leading progress on microelectronics
One of the Chair’s objectives is to promote the flow of R&D to enable a symbiosis between the UPV and companies. The benefits of this symbiosis range from scientific publications at the academic end of the spectrum to transferable results at the business end. Furthermore, in support of the training of doctoral students, there are several research groups that maintain continuous activity in the Chair’s lines of research with which we will collaborate on different areas.
The UPV-VaSiC International Chair of Microelectronic Design is at the cutting edge of microelectronics research. We are dedicated to exploring and developing innovative technologies which transform the global technological landscape. As leaders in this discipline, our research not only drives scientific expertise, but also has a direct impact on the sector and society.
Our research initiatives include:
- Our research initiatives include:
We tackle all the critical areas of microelectronics from digital and analogue design, system verification and modelling to semiconductor integration and advanced circuit manufacture. - Collaborative projects with industry:
We work closely with leading companies to develop practical solutions and advance semiconductor technology, ensuring effective knowledge and technology transfer. - Industrial doctorates:
We offer doctoral programs in collaboration with companies, enabling students to conduct advanced research while applying their knowledge in real-world environments. - Participation in European and National Projects:
We act as key partners in various initiatives and research tenders, positioning the UPV and VaSiC as leaders in microelectronics.
research lines of the UPV-VaSiC Chair of Microelectronic Design
Digital design and DSP
Includes subjects related to digital design from the perspective of both industrial development (back-end digital design, test design, production performance enhancement, reduction of consumption) and research activity focusing on more academic topics, such as structures for high-frequency signal processing.
Verification, system modelling and high-level synthesis
Verification techniques and languages (SystemVerilog and UVM-based verification) are especially important within this line, since this is one of the most valued aspects in a microelectronics industry dedicated to the development of digital systems. The modelling of complex systems is also linked to verification processes. Finally, the possibilities offered by high-level synthesis (HLS) will be explored.
Microprocessors and co-design
Its objective is the development of microprocessor-based Systems-on-a-Chip (SoC), especially those related to RISC-V architectures. Activities include hardware/software co-design techniques, development of accelerators for processing, and creation of IP.
Analogue design
Covers the most active lines of work in front-end analogue microelectronics, including integrated power supply systems (LDOs), bandgap design, chip sensor integration and all analogue baseband signal processing systems (e.g., op-amps).
RF design
This line is dedicated to study and research on the elements necessary for the design of signal chains in bands above one gigahertz. These include low-noise amplifiers (LNAs), PLLs and frequency synthesizers, power amplifiers for signal transmission and the distribution of high-frequency signals within communications SoCs.
AD/DA converters
The objective of this line focuses on the design of analogue>digital converters and vice versa. It covers the two main types, Nyquist and Oversampling, with an emphasis on Sigma-Delta converters and their different types of implementation. Research on this type of converter is currently very active and its application has been greatly extended at the industrial level.
Design of high-speed PCBs and multi-chip modules
This is currently a highly active line of research, since it has permitted the integration of different silicon cores in a very small space while maintaining the necessary properties for RF applications, high-performance computing, etc. It covers subjects such as the use of ceramic substrates, the analysis of signal integrity and thermal performance, and the different 3D integration techniques.
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The Chair will recruit the UPV’s best Microelectronics Design researchers. The Chair stimulates interdisciplinary activities and projects in order to enhance the innovative and entrepreneurial capabilities of the UPV.